2.0
NEXSYS® Components
NEXSYS components are solid-state devices that contain no firmware or software and are designed, tested, and qualified to perform reliably in the most demanding military and commercial applications. NEXSYS components are packaged inside VIVISUN switches and indicators (Compact and High Capacity), NEXSYS Modules, and are available as Thru-Hole Devices. For specific performance characteristics, each NEXSYS component section includes parametric data.
Component Performance
The NEXSYS Components are commercial-off-the-shelf (COTS) items. This standard catalog hardware includes features to allow for flexible interface design solutions while also meeting aircraft performance standards. The NEXSYS Components are designed, tested, and qualified to MIL-PRF-22885/116, MIL-PRF-22885/117, DO-160 and MIL-STD-461 requirements. Specifications are available in our MIL-PRF and DO-160 Documents page, and the qualification table is available in Appendix A. Detailed test data is made available upon request.
Component Series
Four (4) component series designations define the form factor and number of I/O pins: Series A, Series C, Series N, or Series R, see Figure 2.0.0.0-A. Component series also refers to functionality, configuration, and packaging options of NEXSYS components.
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4 Pin | 8 Pin | 8 Pin | 12 pin |
Component Configurations
NEXSYS components are packaged inside VIVISUN switches and indicators (Compact and High Capacity), NEXSYS Modules, and are available as Thru-Hole Devices, see Figure 2.0.0.0-B.
- For NEXSYS Module packaging options, see Section 3.0.
- For VIVISUN switch and indicator packaging options, see Section 4.0.
- For NEXSYS Thru-Hole Device specifications, see Section 5.0.
NEXSYS Module (See 3.1) |
VIVISUN Compact Body (See 4.1.1) |
VIVISUN High Capacity Body (See 4.1.2) |
NEXSYS Thru-Hole Devices (See 5.1) |
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Component Functions and Series
NEXSYS Components are categorized according to application function, and summarized in the table below.
Figure 2.0.0.0-C |
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Function | Description | Series |
Data Conversion | ||
ARINC 429 Signal Converters | Autonomous ARINC 429 receivers with the protocol logic necessary to capture and convert a specified data-word to discrete output(s), controlled by the decode of a single label and bit, multiple-bits, or multi-bit Binary Decode (BD), see 2.1.1. |
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Signal Switching/Control | ||
Defined Logic | Digital electronic device that performs Boolean logic gate operations AND, OR, NOT, NAND, NOR, XOR, XNOR, as well as BUFFER, see 2.2.1. |
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Solid State Relay | Normally Open (NO) and Normally Closed (NC) solid-state relays available individually (SSR) or in a combination of four (SSRCH). The bidirectional inputs are polarity insensitive, and the device performs buffered switching with optical isolation between inputs and outputs, see 2.2.2. |
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State Control | ||
Electronic Latch | Electronic latching with multiple trigger modes to activate orthogonal switching (flip-flop) between two known states and a 1Hz blink output, see 2.3.1. |
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Electronic Rotary | Electronic rotary control that performs incremental switching through a loop of up to four latched output states, controlled by input level transitions, see 2.3.2. |
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Timing | ||
Pulse/Timer | Dual-channel edge detector and pulse generator with independent channels to perform stable retriggerable/resettable one-shot operation for fixed timing applications. Pulse-width output timing options range from 125 ms to 20 sec, see 2.4.1. |
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Time Delay
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Time-delay output, controlled by input triggers or power-up. Output timing options range from 125 ms to 4 hrs, see 2.4.2. |
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Square Wave Oscillator
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Oscillating output controlled by input triggers or power-up. Frequency (cycles/sec) and Period (sec/cycle) options range from 0.25 Hz (4 sec) to 500 Hz (0.002 sec), see 2.4.3. |
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Sensing | ||
Voltage Sensor | Direct Current (DC) voltage sensor performs undervoltage and overvoltage detection to trigger the output. Sensed-voltage (VSD1) setpoint options range from +1 to 48 VDC, and sensed-low voltage (VSD2) setpoint options range from 50 mVDC to 1000 mVDC (+1 VDC), see 2.5.1. |
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Current Sensor
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Direct Current (DC), low-side current sensor that performs undercurrent and overcurrent detection to trigger the output. Sensed-current setpoint options range from 10 mA to 1000 mA (1.0 A), see 2.5.2. |
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Passive | ||
Diode Pack | Package of two diodes specified as either commercial (1N6484) or military (1N5621JANTX) grade, see 2.6.1. |
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Terminal Block | 4-splice configuration for increased wiring efficiency, see 2.6.2. |
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